Applications
Spin Coater ToolsFor decades the process of spin coating has been used to apply a resist film over a silicon wafer as part of the broader process of microcircuit fabrication necessary to produce high yielding silicon wafers. |
BEOL Processes For Semiconductor LithographyBEOL semiconductor tools for WLCSP (Wafer level chip scale packaging) take advantage of many lithographic techniques utilized in the manufacture of the chip in the Front End of Line (FEOL). |
Photoresist Coat and DevelopOur resist processing systems like the Scene 12 employ advanced Meta-Form design pushing the cost-performance curve… |
Polyimide Coat and Develop, Negative ToneOur unique hot plate oven design eliminates the possibility of solvent reflux. Our robotic handling ensures contaminant free back side cleanliness. |
Coating of Photo Active and Non Photo Active Protective Films in WLCSPIndustry leading film thickness uniformities for these viscous and difficult to coat polymers |
TMAH Puddle Develop Negative and Positive ToneAs the aqueous develop is essentially an etch, it is important that corrosion rather than erosion be the only process so that develop “hot spots” can be avoided. |
Photoresist Processing of Lithium Niobate And Other Pyroelectric SubstratesThe primary difficulty in coating substrates of pyroelectric materials is that the materials will build substantial charges leading to very high voltages when heated. |
Thick Photoresist Films Processing For Copper Pillar And Gold Bump ProcessesIn the formation of both gold bumps and copper pillars it is required to contain the “plated up” structure within a “mold” of polymer material. |
Solder Flux Deposit, Reflow and Flux CleanSmall footprint fully automated single wafer reflow processing using flux and flux cleaning spinners robotically coupled to atmospheric controlled reflow hot plates. |
Wafer Edge ExposureWafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed. |
Lift Off Resist (LOR) ProcessingThe S-Cubed LOR processor is designed to perform both LOR and Photoresist Patterning processes automatically and sequentially. |
Negative Tone Lift Off Resist ProcessingEffective negative LOR processing requires excellent film thickness uniformity & precise, repeatable control of hot plate baking conditions… |
Metal Lift Off CleaningFully automated single wafer lift-off using both high pressure dispense of solvents, and/or immersed and heated “soaks” |
Photoresist Stripping and Rework CleaningOur Scene 12 provides fully automated single wafer stripping using both high pressure dispense of solvents, and/or immersed and heated “soaks” |
WEE Combined with DevelopMinimizes work in process inventory by combining the WEE and develop processes in a single automated tool. |
WEE Processing Of Negative Tone Resists For Protective Seal RingsWafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed. |