Photoresist Stripping and Rework Cleaning
Wet chemical cleans typically involve “Wet Bench” Batch type tools. As the Semiconductor industry and the companion wafer level packaging industry evolves more process need to be done on a single wafer basis to ensure a dynamic removal of unwanted material during spin processing. S-Cubed’s long familiarity with photolithographic spin processing has been adapted to this new application. The principal differences as between the wet chemical processing operation and a photoresist develop is the actual chemistry employed. A Photolithographic develop process is a wet chemical etch/clean process. In some wet chemical etch/cleans far more aggressive chemistries are employed for that reason some of the materials used in the construction of the tool must be changed. We have done just that by providing High Alumina ceramics and all Teflon plumbing where appropriate in employing our wet chemical processing tools to the etch/clean process.
Key elements in our semiconductor cleaning process tool that allow this evolution in performance include:
- Programmability. Our tool enables multiple processes and chemistries to be used and allows the user to program the process parameters throughout the operation.
- Process uniformity.. The use of radial arms to dispense chemistries over the wafer permits control of the aerial residence time as the arm moves. We refer to thus capability as Constant Aerial Timing or CAT. The arm moves more quickly as the center of the wafer is approached and more slowly as the wafer’s edge is approached. This is a feature unique to S-Cubed.
- Dry IN, Dry Out.. The process is “dry in and dry out” as both sides of the wafer can be processed simultaneously. And the final chuck based spin process separates the often incompatible fluids permitting recirculation as appropriate.