Flux Reflow, Clean, and Fluxless Reflow (Formic Acid)
S-cubed’s thermal reflow chamber design is unique in the world for its ability to marry throughput capability with extreme thermal profiling accuracy. With the S-cubed design you no longer have to move wafers between hot plates or rely on a large nitrogen filled conveyor furnace which was never intended for wafer level processing. With the S-Cubed reflow configuration, nitrogen consumption in the design is so reduced that the machine pays for itself in a short period of time just through nitrogen savings.
- Enclosed local hotplate environment uses less N2 per wafer than any other reflow technology.
- Worlds fastest move into a chill profile, as the substrates do not need to move to separate hot plates or furnace chambers.
- Reflow in an enclosure with formic acid (flux or fluxless process programmable in same unit)
- Greater temperature profile control and uniformity.
- Clean room compatible processing
- Ultra small footprint
SOLDER BALL REFLOW
The melting and adhesion of solder balls dropped on prepared screen-printed pads of flux is a standard industrial process generally referred to as solder ball reflow. The reflow process is typically carried out in conveyor ovens using forced convection for uniformity
Device package dimensions have shrunk, necessitating the reduction of the pitch for device to package interconnections. This need has led to copper pillar “bumping” in which a pillar of copper is plated into a mold typically formed of photoresist.