Photoresist Coat and Develop
Our resist processing systems like the Scene 12 employ advanced Meta-Form design pushing the cost-performance curve…
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- Multiple Spinners with Self Cleaning Spin Cups
- Up to 300mm Wafer Develop & Coat of films from 1u to100u
- Programmable dispense heights
- Dual arm dispensers up to four fluids per dispense arm
- Multiple Thermal modules
- Self-Cleaning Hot Plate Reduces Downtime
- High Speed Dual End Effector Robot Swaps at Process Modules and Cassettes
- Sophisticated Module Stacking for Lowest Possible Footprint
Polyimide Coat and Develop
Our unique hot plate oven design eliminates the possibility of solvent reflux. Our robotic handling ensures contaminant free back side cleanliness.
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- Self-Cleaning Bowls
- Backside Protection
- Proprietary develop process provides improved uniformity and throughput
- Programmable dispense height for vicious polymers
- Processes wafers up to 300 mm (Scene 12)
TMAH Puddle Develop
As the aqueous develop is essentially an etch, it is important that corrosion rather than erosion be the only process so that develop “hot spots” can be avoided.
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- Zero impact, near instantaneous puddle creation
- Programmable puddle agitation
- Improves uniformity and throughput
- Optional develop temperature control
- Reduces chemical consumption
Photoresist Processing Of Lithium Niobate And Other Pyroelectric Substrates
The primary difficulty in coating substrates of pyroelectric materials is that the materials will build substantial charges leading to very high voltages when heated.
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- Zero Wafer breakage Due to unique wafer handling, heating and cooling.
- S-Cubed proprietary processes for both heat/chill create higher yields
Thick Photoresist Films Processing For Copper Pillar And Gold Bump Processes
In the formation of both gold bumps and copper pillars it is required to contain the “plated up” structure within a “mold” of polymer material.
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- Packaging processes for high volume manufacturing
- Handles warped substrates
- Integrated WEE
- Supports long bake process with high throughput
Solder Flux Deposit, Reflow And Flux Clean
Small footprint fully automated single wafer reflow processing using flux and flux cleaning spinners robotically coupled to atmospheric controlled reflow hot plates.
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- Wafer level ultra clean processing (class 10)
- Greatly reduced N2 consumption
- Precise, programmable temperature proof control
- Lowest Cost of Ownership
- Programmable for flux formic acid processing
Wafer Edge Exposure
Wafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed.
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- Flat Following
- LED Illumination
- Closed Loop Exposure
- Warped Wafer Capability
- Small Footprint/High throughput
- Up to 300 mm Wafers
Lift Off Processing
The S-Cubed LOR processor is designed to perform both LOR and Photoresist Patterning processes automatically and sequentially.
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- Supports recycled acetone lift off process
- Supports heated NMP soak and spray clean
- Both Positive and Negative Tone Lift off processing supported
- Low Cost of Ownership
Metal Lift Off Cleaning
Fully automated single wafer lift-off using both high pressure dispense of solvents, and/or immersed and heated "soaks"
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- Supports recylcled acetone lift-off process
- Supports heated NMP soak & spray clean
- Low overall Cost of Ownership (COO)
- Small factory footprint
Photoresist Stripping and Rework Cleaning
Our Scene 12 provides fully automated single wafer stripping using both high pressure dispense of solvents, and/or immersed and heated "soaks"
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- Dispense options include high pressure spray
- Megasonic
- Wafer soak options
- Supports wet in, dry out
- Supports dry-in, dry-out
- Nylon brush
- PVA Brush
- Nitrogen assisted droplet impact cleaning
WEE Combined with Develop
Minimizes work in process inventory by combining the WEE and develop processes in a single automated tool.
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- Less interruption of workflow, with less handling.
- Lower total equipment cost/wafer due to the higher integration. No need to purchase separate tools for coat and develop.
- A reduction of Work In Process Inventory (WIP)
- Coordinated multi-process control from a single programmable system means higher reliability and fewer points of failure.
- More wafer finishing processes taking up less floor space in your fab.
Thermal Reflow Systems for Solder Balls and Pillars
