Since the adoption of new process nodes has been significantly slowed down due to availability and cost of next generation FEOL lithography technologies, it is ever more important that the continuation of cost reductions and… Continue reading Lowering Cost of Ownership (COO): “Track” Tools in Back end of the Line (BEOL) Thick Resist Film processes
In earlier writings we have discussed cost of ownership issues (COO) related to photoresist processing tools. In this entry, we will discuss the important functional differences between tools generally intended for the FEOL, and those… Continue reading Why Back End of Line (BEOL) Photoresist “Track” Tools Are & Must Be Different from Front End of Line (FEOL) Photoresist Processors
A very important aspect of cost of ownership (COO) of tools that include spin coaters and developers (often referred to a photoresist track tools) in the back end of line (BEOL), MEMS, and patterned sapphire… Continue reading System Granularity and Management of Change and Growth
