Lowering Cost of Ownership (COO) “Track” Tools in Back end of the Line (BEOL) Thick Resist Film processes

As it becomes apparent that the adoption of new process nodes has been significantly slowed down due to availability and cost of next generation FEOL lithography technologies, it becomes ever more important that the continuation… Continue reading Lowering Cost of Ownership (COO) “Track” Tools in Back end of the Line (BEOL) Thick Resist Film processes

Why Back End of Line (BEOL) Photoresist “Track” Tools are and must be Different from Front End of Line (FEOL) Photoresist Processors

In earlier writings we have discussed cost of ownership issues (COO) related to photoresist processing tools. In this entry, we will discuss the important functional differences between tools generally intended for the FEOL, and those… Continue reading Why Back End of Line (BEOL) Photoresist “Track” Tools are and must be Different from Front End of Line (FEOL) Photoresist Processors

System Granularity and Management of Change and Growth

A very important aspect of cost of ownership (COO) of tools that include spin coaters and developers (often referred to a photoresist track tools) in the back end of line (BEOL), MEMS, and patterned sapphire… Continue reading System Granularity and Management of Change and Growth

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