For decades the process of spin coating has been used to apply a resist film over a silicon wafer as part of the broader process of microcircuit fabrication necessary to produce high yielding silicon wafers.
BEOL semiconductor tools for WLCSP (Wafer level chip scale packaging) take advantage of many lithographic techniques utilized in the manufacture of the chip in the Front End of Line (FEOL).
Our resist processing systems like the Scene 12 employ advanced Meta-Form design pushing the cost-performance curve…
Our unique hot plate oven design eliminates the possibility of solvent reflux. Our robotic handling ensures contaminant free back side cleanliness.
Industry leading film thickness uniformities for these viscous and difficult to coat polymers.
As the aqueous develop is essentially an etch, it is important that corrosion rather than erosion be the only process so that develop “hot spots” can be avoided.
The primary difficulty in coating substrates of pyroelectric materials is that the materials will build substantial charges leading to very high voltages when heated.
In the formation of both gold bumps and copper pillars it is required to contain the “plated up” structure within a “mold” of polymer material.
Small footprint fully automated single wafer reflow processing using flux and flux cleaning spinners robotically coupled to atmospheric controlled reflow hot plates.
Wafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed.
The S-Cubed LOR processor is designed to perform both LOR and Photoresist Patterning processes automatically and sequentially.
Effective negative LOR processing requires excellent film thickness uniformity & precise, repeatable control of hot plate baking conditions…
Fully automated single wafer lift-off using both high pressure dispense of solvents, and/or immersed and heated “soaks”
Our Scene 12 provides fully automated single wafer stripping using both high pressure dispense of solvents, and/or immersed and heated “soaks”
Minimizes work in process inventory by combining the WEE and develop processes in a single automated tool.
Wafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed.
