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"The Scene" Architecture

BY S-CUBED

The Industry's most unique modular architecture allows for the creation of exactly the machine you need in the small footprint you want, while maintaining
high production throughput and extraordinary reliability.

S-Cubed wafer processing systems reflect our philosophy of advanced process performance using a field proven modular architecture. The Scene Architecture handles wafers up to 300 mm while providing more capability in less space at lower cost than any system from any manufacturer world-wide.

 The Scene Architecture takes wafer processing to it’s fullest potential with more stacked processes, higher reliability, and lower maintenance requirements than ever before, while keeping overall footprint low.

One Architecture, Many Processes.

PHOTORESIST, COAT &
DEVELOP

Extreme accuracy and reliability are the legacy of all our wafer processing machines. Our modular architecture means you get exactly the machine you need, not the premade machine you are forced to buy.

LIFT OFF
RESIST
PROCESSING

The S-Cubed LOR processor is designed to perform both LOR and photoresist patterning processes automatically and sequentially using both high pressure dispense of solvents, and/or immersed and heated “soaks”

WATER
EDGE
EXPOSURE

A Flexible implementation of WEE that can be combined with coat and/or develop modules. Highly integrated for maximum BEOL processing in a small footprint.

THERMAL REFLOW PROCESSES

For creation of solder balls and pillars, our Scene Architecture based reflow machine can perform wafer scale reflow for flux (apply & clean) and fluxless processes.


  • Achieves Extremely high coating uniformity
  • Recipe based interchange of 200mm & 300mm wafers
  • Square wafer handling
  • Extremely low maintenance, self cleaning hot plates and spin bowl.
  • Dual End effector robots for high throughput.
  • Completely programmable dispense heights and positions
  • Low overall cost of ownership



  • Both soak and blast processes accommodated
  • Operator independent from start to finish
  • Handles both positive and negative lift off
  • Excellent film thickness uniformity
  • Lower chemical consumption
  • Efficient modular layout means high functionality to footprint ratio.
  • Low overall cost of ownership

 


  • No manual reloads required for additional wafer finishing processes
  • Many wafer finishing processes in a small footprint.
  • Positive and negative resist processes supported.
  • Capable of wafer etch protection with high accuracy
  • Highly integrated solution for smoother workflow
  • Low overall cost of ownership

 


  • Extreme thermal profiling accuracy
  • Uses less N2 than any other reflow technology
  • Both flux or fluxless processes in same unit.
  • No conveyors or wafer movement required
  • Fastest move into a chill profile in industry
  • Excellent throughput & uniformity
  • Ultra-small footprint
  • Low overall cost of ownership


Standard Features

The Scene processes wafers up to 300mm in diameter.

Our system can instantly do recipe based interchange of 300mm and 200mm wafer and achieves perfect handling of flats on large wafer sizers.

The Scene architecture uses multiple process modules so we can configure exactly the machine capabilities and throughput that you will need for the most efficient and reliable implementation of your process.
  • Advanced needle dispense eliminates solvent overspray.
  • Develop/Coat
  • Programmable dispense heights
  • Dual arm dispensers up to four fluids per dispense arm
  • Self Cleaning Spin Cup
  • Advanced needle dispense eliminates solvent overspray.
  • Develop/Coat
  • Programmable dispense heights
  • Dual arm dispensers up to four fluids per dispense arm
  • Self Cleaning Spin Cup
  • Bake, programmable pin height and fixed proximity combination.
  • Reducing costs and downtime our hot plate does NOT require cleaning.
  • Chill plate is simple no moving parts
  • Advanced needle dispense eliminates solvent overspray.
  • Develop/Coat
  • Programmable dispense heights
  • Dual arm dispensers up to four fluids per dispense arm
  • Self Cleaning Spin Cup
  • Swaps at process modules and cassettes
  • Industry Exclusive precision wafer centering on the end effector at each wafer move, user programmable. The positioning takes place during the move.
  • Tool teaches itself to center the wafer precisely at the spinners. Built in metrology for wafer centering.
  • Advanced needle dispense eliminates solvent overspray.
  • Develop/Coat
  • Programmable dispense heights
  • Dual arm dispensers up to four fluids per dispense arm
  • Self Cleaning Spin Cup

Additional Options

Detailed Specifications

The Scene architecture is specifically designed to offer the lowest overall cost of ownership in the industry. All without sacrificing reliability, performance or longevity.

DOWNLOAD OUR DETAILED SPECIFICATIONS:

For more information please call the S-Cubed engineering team directly at
(973) 263-0640

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