Scene architecture allows for stacked spin bowl and hotplate modules, ensuring the most resources in the smallest footprint for processing wafers up to 300 mm in diameter.
S-Cubed photoresist coat and develop tools are both flexible in their ability to coat both thin and thick films, and reliable in their consistent ability to deliver optimal uniformity. Not only do we develop resist films and processing equipment, we also develop novel processes themselves!
The S-Cubed Typhoon process equipment can be configured for lift-off and resist strip processing. Depending on process requirements, we can implement immersed soaks and agitation, high pressure spray, Megansonic activation of heated chemistries.
S-Cubed WEE Systems are both metrology tools in that they measure diameter and warpage, and exposure tools that ensure perfectly placed edge exposure, regardless of the substrate.
Scene can be configured for thermal reflow of both solder balls and pillars. Depending on configuration, we can support flux apply, reflow and clean, and fluxless formic acid process. One tool allowing for two processes!