Lowest Cost of Ownership High Volume Photoresist Processing – SCENE 8.

The next act in the advancement of photoresist processing systems, the Scene8^tm for up to 200mm wafers (and the Scene12^tm for up to 300mm wafers) provides more capability in less space at lower cost than any system from any manufacturer world wide. Designed for production use with a focus on reliability and throughput.

Scene 8 Wafer Level Chip Scale Processing (WLCSP) Standard Features, not options

• Up to 9 process modules.
  • Multiple spinners
    • Develop/Coat
    • Programmable dispense heights
    • Dual arm dispensers up to four fluids per dispense arm
    • Self Cleaning Spin Cup
  • Multiple Thermal modules
    • Bake, programmable pin height and fixed proximity combination.
    • Reducing costs and downtime our hot plate does NOT require cleaning.
    • Chill plate is simple no moving parts
  • High Speed Dual End Effector Robot
    • Swaps at process modules and cassettes
    • Industry Exclusive precision wafer centering on the end effector at each wafer move, user programmable. The positioning takes place during the move.
    • Tool teaches itself to center the wafer precisely at the spinners. Built in metrology for wafer centering.
  • Scene8^tm can process200mm and 150mm wafers interchangeably with no operator involvement other than select process recipe and press “run”.
  • Fan Filter unit and ionizer
  • For Coating and Developing films from 1 micron to 100 microns.

Detailed Specifications

Photoresist Spinners:

• Maximum spin speed 6000 RPM
• Maximum acceleration 6000 RPM/second
• Precision within 1 revolution in absolute terms
• Programmable dispense height repeatable within 25 microns
• Programmable dispense arm radial position repeatable within 125 microns
• Programmable backside rinse
• Programmable topside EBR
• Dual needle dynamic develop for Negative solvent type develop (no over spray)
• Zero impact puddle build nozzle for Positive type develop
• Programmable Agitation mode for Positive type develop
• All coaters are provided with programmable exhaust rate increase/decrease

Hot plates:

• Programmable temperature up to 180^OC standard higher temperatures upon request.
• Exhaust method eliminates the need to clean the hot plate
• Fixed proximity on ruby spheres set at 110 microns
• Programmable pin height (descent rate for ramping) repeatable within 10 microns
• Hot plate uniformity within .5^OC

Chill plates:

• No moving parts, nesting type, uniformity within 1^OC

Options:

• Dispense pumps (low viscosity, high viscosity)
• Flow sensors monitored by tool and range settable by user for process fluids
• Syringe dispenser
• WaferWatcher ^tm video recorder
• Built in film metrology unit.