Whitepapers
Lowering Cost of Ownership (COO) “Track” Tools in Back end of the Line (BEOL) Thick Resist Film processes
As it becomes apparent that the adoption of new process nodes has been significantly slowed down due to availability and cost of next generation FEOL lithography technologies, it becomes ever more important that the continuation
Creating Value With “Track” Tools in Back end of the Line (BEOL)
The Semiconductor Industry has for years followed the path of “Moore’s” Law. Gordon Moore’s forecast that the industry would every 18 months double the number of transistors in a given area, thereby increasing value while
Why Back End of Line (BEOL) Photoresist “Track” Tools are and must be Different from Front End of Line (FEOL) Photoresist Processors
In earlier writings we have discussed cost of ownership issues (COO) related to photoresist processing tools. In this entry, we will discuss the important functional differences between tools generally intended for the FEOL, and those
Lowering the Cost of Ownership (COO) of Spin Process Tools
In our last BLOG we discussed the need to lower the COO of the tools of production for those who are both designing and building their chips. The issue that we attempt to address here
