Semiconductor Photoresist, And Cleaning Process Tools

Lowering Cost of Ownership (COO) “Track” Tools in Back end of the Line (BEOL) Thick Resist Film processes

As it becomes apparent that the adoption of new process nodes has been significantly slowed down due to availability and cost of next generation FEOL lithography technologies, it becomes ever more important that the continuation Read More…

Creating Value With “Track” Tools in Back end of the Line (BEOL)

The Semiconductor Industry has for years followed the path of “Moore’s” Law. Gordon Moore’s forecast that the industry would every 18 months double the number of transistors in a given area, thereby increasing value while Read More…

Why Back End of Line (BEOL) Photoresist “Track” Tools are and must be Different from Front End of Line (FEOL) Photoresist Processors

In earlier writings we have discussed cost of ownership issues (COO) related to photoresist processing tools. In this entry, we will discuss the important functional differences between tools generally intended for the FEOL, and those Read More…

Lowering the Cost of Ownership (COO) of Spin Process Tools

In our last BLOG we discussed the need to lower the COO of the tools of production for those who are both designing and building their chips. The issue that we attempt to address here Read More…