The Semiconductor Industry has for years followed the path of “Moore’s” Law. Gordon Moore’s forecast that the industry would every 18 months double the number of transistors in a given area, thereby increasing value while reducing cost. His prediction has held true for about 20 years, and is now faltering. However the effect of his prediction can and will continue into the foreseeable future but rather than the aerial rule obtaining on silicon it will now move increasingly to the package. That trend is now beginning in earnest and the improvements in functionality and cost will occur more and more in the Back End of the Line (BEOL) /packaging of function. The driving economic factor is clearly the proliferation of mobile devices of all sorts.
While the technology of the photolithographic processing remains very similar there are important details that must be addressed if the tool sets of track and lithography are to be optimized for the new needs. BEOL processes involve different economic drivers, which must be accommodated by the Cost of Ownership (COO) models for BEOL tool sets versus Front End of Line (FEOL) tool sets. For more detail on the subject please see our BLOG entitled “Why Back End of Line (BEOL) Photoresist “Track” tool are and must be different from Front End of Line (FEOL) Photoresist processors.”